Danfoss has introduced several products designed to support liquid cooling systems in AI and high-performance computing (HPC) data centers. The products will be showcased at Supercomputing (SC) 2026, Nov. 16-19 in Chicago.
The new products include the Danfoss Hansen FD83 2.5-inch quick-disconnect coupling, an extension of the company’s FD83 liquid cooling platform. According to Danfoss, the larger coupling provides nearly twice the flow, reduced pressure drop, and a compact size-to-flow ratio for higher-density data center applications.
The company also introduced DataCryo 7G crimp fittings, designed to provide connections for liquid cooling systems. The fittings are compatible with Danfoss DataCryo DC394 and EHW194 hoses and are intended to support coolant transport from the cooling source to the chip.
The CoolTrain 2 is a customizable, plug-and-play solution providing up to 233 kW of liquid cooling capacity. The system connects and balances coolant flow to server racks using flexible hose and a stainless steel, pressure-independent smart control valve.
Danfoss also introduced its e-QC and e-PC stainless steel smart control valves, which electronically balance and control server-rack liquid cooling flows up to 333 liters per minute (88 gpm). The e-QC maintains constant flow, while the e-PC maintains differential pressure. Both incorporate a UL-certified NovoCon M2 digital actuator for dynamic control and data center infrastructure management (DCIM) telemetry.
Additional technologies being showcased by Danfoss include the DataCryo hose series, two-phase liquid cooling solutions, Turbocor compressors with active cooling, hydronic balancing technologies, iC7-HVACR ultra-low harmonic drives, and iC7 liquid-cooled system modules for 800- and 1,500-VDC applications.
The products are designed to address increasing cooling demands as AI and HPC applications drive higher rack densities and heat loads in data centers.
“Danfoss combines three decades of liquid cooling expertise with one of the industry’s broadest data center portfolios, helping customers address the challenges of AI-driven growth,” said Peter Bleday, vice president, Data Center Solutions, Danfoss Power Solutions.
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